Email:sales@unitpcb.comUnion Circuits Co.,Limited

Union Circuits Co.,Limited

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Contact: Mr Kenly Lei

Sales Manager
Tel: +86 755 2970 9763

Skype: kenly.lei

Contact: Ms Echo Yang

International Sales

Tel: +86 755 3350 1949 Ext. 810

Contact: Ms Mary Huang
International Sales

Tel: +86 755 3350 1949 Ext. 812
Skype: h-p88888

Introduction Of Composition Construction Of Aluminum Based PCB

    The first step in the production of image (forming/wire fabrication) is to establish an online wiring between parts. We use negative transfer printing (PCB production Subtractive transfer) way to display the work film on the metal conductor. This technique is to spread the entire surface of a thin layer of copper foil, and to remove the excess parts. Additional transfer (Additive pattern transfer) is another way to use less people, which is a way to apply copper wire only where needed, but we don't have much to talk about here.
   If the production is a double panel, then the PCB on both sides of the substrate will be covered with copper foil, if the production is multilayer board, the next step will be glued to these boards together.Aluminum Based PCB
A positive photoresist (Positive Photoresst) is made from a photosensitive agent that dissolves under illumination (negative photoresist is decomposed if it is not illuminated). There are many ways to deal with the photoresist on the surface of copper, but the most common way is to heat it and roll on the surface containing the photoresist (called the Dry film photoresist). It can also be sprayed in a liquid way, but the dry film provides a relatively high resolution, can also be made to make more fine wire.Aluminum Based PCB
  The hood is just a template for manufacturing PCB layers. In the PCB board of the photoresist after UV light exposure, covering the hood above can prevent the partial area of the photoresist is not exposed (assuming that a positive photoresist). Where the photoresist is covered, it will turn into wiring. Other bare copper parts to be etched after photoresist development. The etching process can be dipped into the etching solvent, or the solvent sprayed on the board. Generally used as etching solvents, ferric chloride (Ferric Chloride), alkaline ammonia (Alkaline Ammonia), sulfuric acid plus hydrogen peroxide (Sulfuric acid + Hydrogen Peroxide), and copper chloride (Cupric Chloride), etc. through oxidation reaction to oxidation (such as Cu). The rest of the photoresist is removed after etching. This is called the Stripping program.Aluminum Based PCB
   If the production is multilayer PCB board, and it contains buried hole or blind hole, each layer of the board before bonding must be drilled and electroplating. Without this step, there is no way to connect to each other. The Kong must be plated (plated through hole technology, Plated-Through technology, PTH) after drilling from the machine equipment according to the drilling requirements. After the metal is processed inside the Kong, the inner layer lines can be connected to each other. Before starting the electroplating, you must clear out the debris in the hole. This is because the resin epoxy will produce some chemical changes after heating, and it will cover the internal PCB layer, so to clear out. The removal and plating action will be done in the chemical process.Aluminum Based PCB

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