Email:sales@unitpcb.comUnion Circuits Co.,Limited

Union Circuits Co.,Limited

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Contact: Mr Kenly Lei

Sales Manager
Tel: +86 755 2970 9763

Skype: kenly.lei

Contact: Ms Echo Yang

International Sales

Tel: +86 755 3350 1949 Ext. 810

Contact: Ms Mary Huang
International Sales

Tel: +86 755 3350 1949 Ext. 812
Skype: h-p88888

PCB Board Assembly Process Requirements

          PCB board assembly process requirements: 1. PCB board After the completion of the initial welding, should be unified number (after the first two + water number). Use a marker to clearly write the left position of the front of the board. In order to prevent the mark loss during processing and cleaning, the same number should be written in the other position of the board (usually on the side of the 96 bend pin). For administrative convenience, this number should be retained permanently. Number management is the responsibility of the librarian.

          2. In order to avoid and minimize scratches on the surface of components, in the processing, transportation, custody board process, should pay attention to light handle, board and board should generally be isolated, or reverse (ie, face-to-face or back-to-back).

          3. In order to prevent the electrostatic effect, the possible contact with the active device operation requires wearing gloves. If there is no condition on site, security measures must be taken to ensure the safety of the device.PCB Assembly

          4. PCB board after the test passed (that is, already have the machine condition), the operator should be responsible for finishing the whole board work, including: (1) cut off the high pin, and pay attention to remove the metal residue on the clean board. (2) The positive flight line should be concealed as far as possible, the back flight line in principle should take the shortcut, the solder joint and the longer flight line must be covered with glass glue, fixed, and as little as possible to use the gum. (3) Clear the excess identification (such as the failure phenomenon recorded during the debugging process to be cleared). Redundant devices should be completely cut off. (4) The color of the rear baffle plate of the same device should be basically consistent. Screws, gaskets, girder should be complete and consistent. Check all kinds of screws, should be kept fastening. (5) Clean the surface with brush and wash board liquid, so that there is no dust and obvious stain dirt on board and board. If you use a cotton swab to remove dirt, you should also pay attention to remove the remaining lint. (6) The defective PCB board of the solder plate shall not be used in the new machine; however, minor damage may be applied to the repair product, where appropriate, in the context of the taking of technological measures and ensuring quality and safety.PCB Assembly

          5. Repair of the repair device PCB board treatment principle Ibid.PCB Assembly

          6. The above finishing work, in addition to the other arrangements, are responsible for PCB testing, repair operators bear, the Assembly has the responsibility to review and correction after the installation.PCB Assembly

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